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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TSL2540 датащи(PDF) 30 Page - OSRAM GmbH |
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TSL2540 датащи(HTML) 30 Page - OSRAM GmbH |
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30 / 38 page  Datasheet, Public Page 29 [v2-00] 2022-Dec-05 Document Feedback TSL2540 − Soldering & Storage Information The QFN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 41: Solder Reflow Profile Figure 42: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5°C/s Soak time tSOAK 2 to 3 minutes Time above 217°C (T1)t1 Max 60s Time above 230°C (T2)t2 Max 50s Time above Tpeak - 10°C (T3)t3 Max 10s Peak temperature in reflow Tpeak 260°C Temperature gradient in cooling Max - 5°C/s Soldering & Storage Information t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) (s) |
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