ams Datasheet

Page 15

[v1-01] 2018-Mar-14

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TCS3200 − Packaging Mechanical Data

This SOIC package consists of an integrated circuit mounted on

a lead frame and encapsulated with an electrically

nonconductive clear plastic compound. The TCS3200 has an

8 × 8 array of photodiodes with a total size of 1mm by 1mm.

The photodiodes are 110μm × 110μm in size and are positioned

on 134μm centers.

Figure 16:

Package D - TCS3200 Plastic Small Outline IC Packaging Configuration

Note(s):

1. All linear dimensions are in millimeters.

2. The center of the 1mm by 1mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).

3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. This drawing is subject to change without notice.

Packaging Mechanical Data

PACKAGE D

PLASTIC SMALL-OUTLINE

A

1.75

1.35

0.50

0.25

4.00

3.80

6.20

5.80

45

5

0.88 TYP TOP OF

SENSOR DIE

5.00

4.80

5.3

MAX

1.27

0.41

0.25

0.10

0.25

0.19

DETAIL A

PIN 1

6

y 1.27

0.510

0.330

8

y

j 2.8 TYP

CLEAR WINDOW

2.12

+ 0.250

3.00

+ 0.250

NOTE B

Pb

PIN 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW

END VIEW

Green

RoHS