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TAS5162DDVR датащи(PDF) 3 Page - Texas Instruments

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номер детали TAS5162DDVR
подробное описание детали  2 x 210 Watt STEREO DIGITAL AMPLIFIER POWER STAGE
PDF  29 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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TAS5162DDVR датащи(HTML) 3 Page - Texas Instruments

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MODE Selection Pins for Both Packages
Package Heat Dissipation Ratings
(1)
TAS5162
SLES194C – OCTOBER 2006 – REVISED MAY 2007
GENERAL INFORMATION (continued)
MODE PINS
PWM INPUT
OUTPUT CONFIGURATION
PROTECTION SCHEME
M3
M2
M1
0
0
0
2N (1) AD/BD modulation
2 channels BTL output
BTL mode, full protection (2)
0
0
1
2N (1) AD/BD modulation
2 channels BTL output
BTL mode, latching shutdown (2)
0
1
0
1N (1) AD modulation
2 channels BTL output
BTL mode, full protection (2)
0
1
1
1N (1) AD modulation
1 channel PBTL output
PBTL mode, full protection. Only PWM_A input
is used.
Protection works similarly to BTL mode (2). Only
difference in SE mode is that OUT_X is Hi-Z
1
0
0
1N (1) AD modulation
4 channels SE output
instead of a pulldown through internal pulldown
resistor.
1
0
1
Protection works similarly to SE Mode (2)
4 channels SE output - No
(1,0,0); however, the PWM input protection is
1N (1) AD modulation
PWM Input protection, latching
disabled. Also, overcurrent detection will latch if
shutdown
an error occurs.
1
1
0
Reserved
1
1
1
(1)
The 1N and 2N naming convention is used to indicate the required number of PWM lines to the power stage per channel in a specific
mode.
(2)
An overload protection (OLP) occurring on A or B causes both channels to shut down. An OLP on C or D works similarly. Global errors
like overtemperature error (OTE), undervoltage protection (UVP), and power-on reset (POR) affect all channels.
PARAMETER
TAS5162DKD
TAS5162DDV
RθJC (°C/W)—2 BTL or 4 SE channels (8 transistors)
1.0
1.1
RθJC (°C/W)—1 BTL or 2 SE channel(s) (4 transistors)
1.5
2.2
RθJC (°C/W)—(1 transistor)
5.0
7.4
Pad area(2)
80 mm2
34 mm2
(1)
JC is junction-to-case, CH is case-to-heatsink.
(2)
RθCH is an important consideration. Assume a 2-mil thickness of typical thermal grease between the pad area and the heatsink and both
channels active. The RθCH with this condition is 2.6°C/W for the DKD package and 4.0°C/W for the DDV package.
3
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