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TMS320DM647 датащи(PDF) 165 Page - Texas Instruments

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номер детали TMS320DM647
подробное описание детали  Digital Media Processor
PDF  166 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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TMS320DM647 датащи(HTML) 165 Page - Texas Instruments

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7
Mechanical Data
7.1 Thermal Data for ZUT
7.1.1 Packaging Information
TMS320DM647/TMS320DM648
Digital Media Processor
SPRS372 – MAY 2007
The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.
See Power Application Report.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
Θ
JC
Junction-to-case
2
R
Θ
JB
Junction-to-board
3
4
R
Θ
JA
Junction-to-free air
5
7
8
PsiJT
Junction-to-package top
9
11
12
PsiJB
Junction-to-board
13
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
(2)
m/s = meters per second
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Submit Documentation Feedback
Mechanical Data
165



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