LOG114

SBOS301A − MAY 2004 − REVISED MARCH 2007

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2

Supply Voltage, V+ to V−

12V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(V−) −0.5V to (V+) + 0.5V

. . . . .

±10mA

. . . . . . . . . . . . . . . . . . . .

Continuous

. . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−40

°C to +85°C

. . . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−55

°C to +125°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Rating (Human Body Model)

2000V

. . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

(2) Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.5V beyond the supply

rails should be current-limited to 10mA or less.

(3) Short-circuit to ground.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PRECISION CURRENT MEASUREMENT

PRODUCTS

FEATURES

PRODUCT

Logarithmic Transimpedance Amplifier, 5V, Eight Decades

LOG114

Logarithmic Transimpedance, 36V, 7.5 Decades

LOG112

Resistor-Feedback Transimpedance, 5V, 5.5 Decades

OPA380,

OPA381

Switched Integrator Transimpedance, Six Decades

IVC102

Direct Digital Converter, Six Decades

DDC112

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

LOG114

QFN-16

RGV

LOG114

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

PIN CONFIGURATION

Top View

QFN−16 (4mm x 4mm)

NC = No Connection

16

15

14

13

1

2

3

4

V

REF GND

NC

I

2

I

1

5

6

Exposed

thermal

die pad on

underside

(Must be

connected to V

−)

78

12

11

10

9

V

O4

−IN

4

+IN

4

V

LOGOUT

QFN-16