NE5019F datasheet(2/6 Pages) PHILIPS

2 / 6 page

Philips Semiconductors Linear Products

Product specification

NE/SE5018/5019

8-Bit

µp-compatible D/A converter

August 31, 1994

752

BLOCK DIAGRAM

(13)

(12)

(20)

(18)

(21)

(22)

(14)

(15)

BIPOLAR

OFFSET

VREF

ANALOG

GND

AMP

COMP

SUM

NODE

DAC CURRENT

OUTPUT

LATCHES AND

SWITCH DRIVERS

DAC SWITCHES

15k

(19)

(10)

MSB

LSB

(1)

DIGITAL

GND

VCC+

INT

VREF

(9)

DB7

(8)

DB6

(7)

DB5

(6)

DB4

(5)

DB3

(4)

DB2

(3)

DB1

(2)

DB0

VCC–

(16)

VOUT

–

DAC

COMP

VREF

OUT

VREF

ADJ

(17)

ABSOLUTE MAXIMUM RATINGS

SYMBOL

PARAMETER

RATING

UNIT

VCC+

Positive supply voltage

VCC-

Negative supply voltage

-18

VIN

Logic input voltage

0 to 18

VREF IN

Voltage at VREF input

VREF ADJ

Voltage at VREF adjust

0 to VREF

VSUM

Voltage at sum node

IREF SC

Short-circuit current to ground at VREF OUT

Continuous

IOUTSC

Short-circuit current to ground or either supply at VOUT

Continuous

Maximum power dissipation, TA=25°C (still-air)1

F package

1740

N package

2190

D package

1600

Operating temperature range

SE5018

-55 to +125

°C

NE5018

0 to +70

°C

TSTG

Storage temperature range

-65 to +150

°C

TSOLD

Lead soldering temperature

(10 seconds)

300

°C

NOTES:

1. Derate above 25

°C at the following rates:

F package at 13.9mW/

°C

N package at 17.5mW/

°C

D package at 12.8mW/

°C

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