OP777/OP727/OP747

REV. D

–15–

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

8°

0°

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65 BSC

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

0.75

0.60

0.45

COPLANARITY

0.10

SEATING

PLANE

Figure 16. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

OP727AR

–40°C to +85°C

8-Lead SOIC_N

R-8

OP727AR-REEL

–40°C to +85°C

8-Lead SOIC_N

R-8

OP727AR-REEL7

–40°C to +85°C

8-Lead SOIC_N

R-8

OP727ARUZ

–40°C to +85°C

8-Lead TSSOP

RU-8

OP727ARUZ-REEL

–40°C to +85°C

8-Lead TSSOP

RU-8

OP727ARZ

–40°C to +85°C

8-Lead SOIC_N

R-8

OP727ARZ-REEL

–40°C to +85°C

8-Lead SOIC_N

R-8

OP727ARZ-REEL7

–40°C to +85°C

8-Lead SOIC_N

R-8

OP747ARU

–40°C to +85°C

14-Lead TSSOP

RU-14

OP747ARU-REEL

–40°C to +85°C

14-Lead TSSOP

RU-14

OP747ARUZ

–40°C to +85°C

14-Lead TSSOP

RU-14

OP747ARUZ-REEL

–40°C to +85°C

14-Lead TSSOP

RU-14

OP747ARZ

–40°C to +85°C

14-Lead SOIC

R-14

OP747ARZ-REEL

–40°C to +85°C

14-Lead SOIC

R-14

OP747ARZ-REEL7

–40°C to +85°C

14-Lead SOIC

R-14

OP777ARMZ

–40°C to +85°C

8-Lead MSOP

RM-8

A1A

OP777ARMZ-REEL

–40°C to +85°C

8-Lead MSOP

RM-8

A1A

OP777ARZ

–40°C to +85°C

8-Lead SOIC_N

R-8

OP777ARZ-REEL

–40°C to +85°C

8-Lead SOIC_N

R-8

OP777ARZ-REEL7

–40°C to +85°C

8-Lead SOIC_N

R-8

1 Z = RoHS Compliant Part.