1996 Jun 10

6

Philips Semiconductors

Product specification

Voltage regulator diodes

BZD23 series

Note

1. Non-repetitive peak reverse current in accordance with

“IEC 60-1, Section 8” (10/1000

µs pulse); see Fig.8.

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.7.

For more information please refer to the

“General Part of associated Handbook”.

BZD23-C180

168

0.09

0.13

5

249

0.60

5

150

BZD23-C200

188

0.09

0.13

5

276

0.54

5

160

BZD23-C220

208

0.09

0.13

2

305

0.50

5

180

BZD23-C240

228

0.09

0.13

2

336

0.45

5

200

BZD23-C270

251

0.09

0.13

2

380

0.40

5

220

BZD23-C300

280

0.09

0.13

2

419

0.36

5

240

BZD23-C330

310

0.09

0.13

2

459

0.33

5

270

BZD23-C360

340

0.09

0.13

2

498

0.30

5

300

BZD23-C390

370

0.09

0.13

2

537

0.28

5

330

BZD23-C430

400

0.09

0.13

2

603

0.25

5

360

BZD23-C470

440

0.09

0.13

2

655

0.23

5

390

BZD23-C510

480

0.09

0.13

2

707

0.21

5

430

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

BZD23-C3V6 to -C6V8

87

K/W

BZD23-C7V5 to -C510

60

K/W

thermal resistance from junction to ambient

note 1

BZD23-C3V6 to -C6V8

145

K/W

BZD23-C7V5 to -C510

120

K/W

TYPE

NUMBER

REVERSE

BREAKDOWN

VOLTAGE

TEMPERATURE

COEFFICIENT

TEST

CURRENT

CLAMPING

VOLTAGE

REVERSE CURRENT

at STAND-OFF

VOLTAGE

(mA)

(A)

note 1

(V)

MIN.

MIN.

MAX.

MAX.

MAX.