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NTLJS3113P датащи(PDF) 2 Page - ON Semiconductor

номер детали NTLJS3113P
подробное описание детали  Power MOSFET ??0 V, ??.7 A, uCool TM Single 2x2 mm, WDFN Package
PDF  6 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTLJS3113P датащи(HTML) 2 Page - ON Semiconductor

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THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
Junction−to−Ambient – Steady State (Note 3)
RqJA
65
°C/W
Junction−to−Ambient – t
≤ 5 s (Note 3)
RqJA
38
Junction−to−Ambient – Steady State Min Pad (Note 4)
RqJA
180
3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
4. Surface Mounted on FR4 Board using the minimum recommended pad size (30 mm2, 2 oz Cu).
MOSFET ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = −250 mA
−20
V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/TJ
ID = −250 mA, Ref to 25°C
−10.1
mV/
°C
Zero Gate Voltage Drain Current
IDSS
VDS = −16 V, VGS = 0 V
TJ = 25°C
−1.0
mA
TJ = 85°C
−10
Gate−to−Source Leakage Current
IGSS
VDS = 0 V, VGS = ±8.0 V
±1.0
mA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
VGS(TH)
VGS = VDS, ID = −250 mA
−0.45
−0.67
−1.0
V
Negative Gate Threshold
Temperature Coefficient
VGS(TH)/TJ
2.68
mV/
°C
Drain−to−Source On−Resistance
RDS(on)
VGS = −4.5, ID = −3.0 A
32
40
m
W
VGS = −2.5, ID = −3.0 A
44
50
VGS = −1.8, ID = −2.0 A
67
75
VGS = −1.5, ID = −1.8 A
90
200
Forward Transconductance
gFS
VDS = −16 V, ID = −3.0 A
5.9
S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
CISS
VGS = 0 V, f = 1.0 MHz,
VDS = −16 V
1329
pF
Output Capacitance
COSS
213
Reverse Transfer Capacitance
CRSS
120
Total Gate Charge
QG(TOT)
VGS = −4.5 V, VDS = −16 V,
ID = −3.0 A
13
15.7
nC
Threshold Gate Charge
QG(TH)
1.5
Gate−to−Source Charge
QGS
2.2
Gate−to−Drain Charge
QGD
2.9
Gate Resistance
RG
14.4
W
SWITCHING CHARACTERISTICS (Note 6)
Turn−On Delay Time
td(ON)
VGS = −4.5 V, VDD = −10 V,
ID = −3.0 A, RG = 3.0 W
6.9
ns
Rise Time
tr
17.5
Turn−Off Delay Time
td(OFF)
60
Fall Time
tf
56.5
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Recovery Voltage
VSD
VGS = 0 V, IS = −1.0 A
TJ = 25°C
−0.78
−1.2
V
TJ = 125°C
−0.67
Reverse Recovery Time
tRR
VGS = 0 V, dISD/dt = 100 A/ms,
IS = −1.0 A
70.8
106
ns
Charge Time
ta
14.3
Discharge Time
tb
56.4
Reverse Recovery Time
QRR
44
nC
5. Pulse Test: Pulse Width
v 300 ms, Duty Cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.



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