2.3

ES9018S Product Datasheet

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM

52

RPC-1 Classification reflow profile

Profile Feature

Pb-Free Assembly

Preheat/Soak

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (ts) from (Tsmin to Tsmax)

150°C

200°C

60-120 seconds

Ramp-up rate (TL to Tp)

3°C / second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217°C

60-150 seconds

Peak package body temperature (Tp)

For users Tp must not exceed the classification temp in Table RPC-

2.

For suppliers Tp must equal or exceed the Classification temp in

Table RPC-2.

Time (tp)* within 5°C of the specified

classification temperature (Tc), see Figure

RPC-1

30* seconds

Ramp-down rate (Tp to TL)

6°C / second max.

Time 25°C to peak temperature

8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

Table 16 - RPC-1 Classification reflow profile

Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are reflowed in other

than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ±2°C of the live-bug Tp and still meet the Tc requirements, otherwise, the profile shall

be adjusted to achieve the latter. To accurately measure actual peak package body temperatures refer to JEP140 for recommended thermocouple use.

Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly profiles should be developed

based on specific process needs and board designs and should not exceed the parameters in Table RPC-1.

For example, if Tc is 260°C and time tp is 30 seconds, this means the following for the supplier and the user.

For a supplier: The peak temperature must be at least 260°C. The time above 255°C must be at least 30 seconds.

For a user: The peak temperature must not exceed 260°C. The time above 255°C must not exceed 30 seconds.classification profile requirements.

RPC-2 Pb-Free Process - Classification Temperatures (Tc)

Package Thickness

Volume mm3, <350

Volume mm3, 350 to 2000

Volume mm3, >2000

<1.6 mm

260°C

260°C

260°C

1.6 mm - 2.5 mm

260°C

250°C

245°C

>2.5 mm

250°C

245°C

245°C

Table 17 - RPC-2 Pb-Free Process - Classification Temperatures (Tc)

Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in Table

RPC-2. The use of a higher Tp does not change the classification temperature (Tc).

Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or non-integral heat sinks.

Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients

between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.