6.4 Thermal Information: OPA186

THERMAL METRIC(1)

OPA186

UNIT

D (SOIC)

DBV (SOT-23)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

135.3

166.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

75.6

62.2

°C/W

RθJB

Junction-to-board thermal resistance

78.7

38.6

°C/W

ΨJT

Junction-to-top characterization parameter

25.4

12.1

°C/W

ΨJB

Junction-to-board characterization parameter

78.0

38.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2186

THERMAL METRIC(1)

OPA2186

UNIT

DDF (SOT-23)

D (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

150.4

128.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

85.6

69.2

°C/W

RθJB

Junction-to-board thermal resistance

70.0

72.3

°C/W

ΨJT

Junction-to-top characterization parameter

8.1

20.7

°C/W

ΨJB

Junction-to-board characterization parameter

69.6

71.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4186

THERMAL METRIC(1)

OPA4186

UNIT

D (SOIC)

14 PINS

RθJA

Junction-to-ambient thermal resistance

84.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

37.4

°C/W

RθJB

Junction-to-board thermal resistance

41.4

°C/W

ΨJT

Junction-to-top characterization parameter

6.7

°C/W

ΨJB

Junction-to-board characterization parameter

40.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA186, OPA2186, OPA4186

SBOS968C – JUNE 2022 – REVISED JULY 2023

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