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AD5821 датащи(PDF) 5 Page - Analog Devices |
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AD5821 датащи(HTML) 5 Page - Analog Devices |
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5 / 16 page ![]() AD5821 Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating VDD to AGND –0.3 V to +5.5 V VDD to DGND –0.3 V to VDD + 0.3 V AGND to DGND –0.3 V to +0.3 V SCL, SDA to DGND –0.3 V to VDD + 0.3 V XSHUTDOWN to DGND –0.3 V to VDD + 0.3 V ISINK to AGND –0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −30°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ MAX) 150°C WLFCSP Power Dissipation (TJ MAX − TA)/θJA θJA Thermal Impedance1 Mounted on 4-Layer Board 95°C/W Lead Temperature, Soldering Maximum Peak Reflow Temperature2 260°C (±5°C) 1 To achieve the optimum θJA, it is recommended that the AD5821 be soldered on a 4-layer board. 2 As per JEDEC J-STD-020C. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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