Analog Integrated Circuit Device Data

Freescale Semiconductor

23

34653

REVISION HISTORY

REVISION HISTORY

REVISION

DATE

DESCRIPTION OF CHANGES

6.0

2/2006

•

Changed Document Order No.

7.0

8/2006

•

Corrected PIN CONNECTIONS on page 3

•

Updated document to the prevailing Freescale form and style

•

Updated PACKAGE DIMENSIONS on page 22

8.0

2/2007

•

Added Part Number MCZ34653EF/R2 to Ordering Information

•

Added RoHS logo

•

Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from

MAXIMUM RATINGS on page 4.

•

Added note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC

standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels

(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter

the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on

page 4.