MP1909

– 30V, HIGH-FREQUENCY HALF-BRIDGE GATE DRIVER

MP1909 Rev. 1.0

www.MonolithicPower.com

3

7/10/2020

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2020 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

BST

Bootstrap. This is the positive power supply for the internal floating high-side MOSFET

driver. Connect a bypass capacitor between the BST and SW pins.

2

PWM

Control signal input for the high-side and low-side drivers. Setting PWM to logic high

turns on the high-side MOSFET; setting PWM to logic low turns on the low-side MOSFET.

3

EN

On/off control. Set EN high to turn on the IC; set EN low to turn it off.

4

VCC

Supply input. This pin supplies power to all the internal circuitry. Place a decoupling

capacitor to ground, and close to this pin to ensure stable and clean supply.

5

DRVL

Low-side driver output.

6

GND

Chip ground.

7

SW

Switching node.

8

DRVH

Floating driver output.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VCC) .....................-0.3V to +15V

SW voltage (VSW)……………..-0.3V (-5V <10ns)

.................................... to +35V (45V <10ns)

BST voltage (VBST) ........................-0.3V to +50V

BST to SW ....................................-0.3V to +15V

DRVH to SW ............. -0.3V to (BST-SW) + 0.3V

DRVL to GND ................... -0.3V to (VCC + 0.3V)

EN, PWM .....................................-0.3V to +5.5V

Continuous power dissipation (TA = 25°C) (2) (5)

………………………………………………... 2.2W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ...................... 1000V

Charged device model (CDM)..................1000V

Recommended Operating Conditions (3)

Supply voltage (VCC) .................... 4.5V to 12V (4)

Power input voltage (VIN) .................0.8V to 30V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

θJA

θJC

SOT583

EV1909-TL-00A (5)

.......... 55 ...... 21... °C/W

JESD51-7 (6)

......... 130 ..... 60... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient thermal resistance,

θ

JA, and the ambient temperature,

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4) 4.5V/12V is only a typical value for the supply voltage.

5) Measured on EV1909-TL-00A, 2-layer PCB.

6)

The value of θ

JA given in this table is only valid for comparison

with other packages and cannot be used for design purposes.

These values were calculated in accordance with JESD51-7,

and simulated on a specified JEDEC board. They do not

represent the performance obtained in an actual application.