6.4 Thermal Information

THERMAL METRIC (2) (1)

Legacy Chip

New Chip

UNIT

DBV (SOT23-5)

DBV (SOT23-5)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

205.4

178.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

78.8

77.9

°C/W

RθJB

Junction-to-board thermal resistance

46.7

47.2

°C/W

ψJT

Junction-to-top characterization parameter

8.3

15.9

°C/W

ψJB

Junction-to-board characterization parameter

46.3

46.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

(2)

Thermal performance results are based on the JEDEC standard of 2s2p PCB configuration. These thermal metric parameters can be

further improved by 35-55% based on thermally optimized PCB layout designs. See the analysis of the Impact of board layout on LDO

thermal performance application report.

6.5 Electrical Characteristics

specified at TJ = 25°C, VIN = VOUT(nom) + 1.0 V or VIN = 2.5 V (whichever is greater), IOUT = 1 mA, VON/OFF = 2 V, CIN = 1.0

µF, and COUT = 2.2 µF (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT

∆VOUT

Output voltage tolerance

IL = 1 mA

Legacy chip

(standard

grade)

–1.5

1.5

%

Legacy chip

(A grade)

–1.0

1.0

New chip

–0.5

0.5

1 mA ≤ IL ≤ 50 mA

Legacy chip

(standard

grade)

–2.5

2.5

Legacy chip

(A grade)

–1.5

1.5

New chip

–0.5

0.5

1 mA ≤ IL ≤ 150 mA

Legacy chip

(standard

grade)

–3.0

3.0

Legacy chip

(A grade)

–2.5

2.5

New chip

–0.5

0.5

1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

–3.5

3.5

Legacy chip

(A grade)

–2.5

2.5

New chip

–1

1

1 mA ≤ IL ≤ 150 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

–4.0

4.0

Legacy chip

(A grade)

–3.5

3.5

New chip

–1

1

ΔVOUT(ΔVIN) Line regulation

VO(NOM) + 1 V ≤ VIN ≤ 16 V

Legacy chip

0.007 0.014

%/V

New chip

0.002 0.014

VO(NOM) + 1 V ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C

Legacy chip

0.007 0.032

New chip

0.002 0.032

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LP2985, LP2985A

SLVS522R – JULY 2004 – REVISED JULY 2023

Copyright © 2023 Texas Instruments Incorporated

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