LTM8063 datasheet(2/26 Pages) AD

2 / 26 page

LTM4709

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN1, VIN2, VIN3............................................. –0.3V to 6V

VOUT1, VOUT2, VOUT3 .................................... –0.3V to 6V

VOUTS1, VOUTS2, VOUTS3............................... –0.3V to 6V

BIAS1, BIAS2, BIAS3 ................................... –0.3V to 6V

VO10, VO11, VO12, VO20, VO21, VO22,

VO30, VO31, VO32 ....................................... –0.3V to 5.5V

EN1, EN2, EN3.............................................. –0.3V to 6V

IMON1, IMON2, IMON3, IMONR1,

IMONR2, IMONR3........................................ –0.3V to 6V

PG1, PG2, PG3, PGR1, PGR2, PGR3, VIOC1 –0.3V to 6V

VREF1, VREF2, VREF3...................................... –0.3V to 6V

Operating Junction Temperature (Note 2)

E-Grade/I-Grade................................. –40°C to 125°C

H-Grade ............................................. –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Maximum Reflow (Package Body) Temperature..... 260°C

(Note 1)

TOP VIEW

BGA PACKAGE

98-PIN (6mm × 12mm × 1.92mm)

TJMAX = 150°C,

θJCtop = 15.5°C/W, θJCbottom = 3°C/W, θJA = 15°C/W, WEIGHT = 331mg

NOTES:

1.θ VALUES ARE DETERMINED BY SIMULATION PER JESD-51 CONDITIONS.

2.θJA VALUE IS OBTAINED WITH DEMO BOARD.

3.SEE THE APPLICATION INFORMATION SECTION FOR LAB

MEASUREMENT DERATING INFORMATION.

IMONR1 PGR1 BIAS1 IMON1 VREF1

VIOC1

PG2

EN1

VO10

VO11

VO12

EN2 IMONR2 PGR2 BIAS2 IMON2 VREF2

PG1

PG3

VO30

VO31

VO32

VO20

VO21

EN3 IMONR3 PGR3 BIAS3 IMON3 VREF3

VO22

VOUTS1

VOUT1

VOUT2

VOUT3

VIN1

VIN2

VIN3

VOUTS2

VOUTS3

GND

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4709EY#PBF

SAC305 (RoHS)

4709

BGA

–40°C to 125°C

LTM4709IY#PBF

SAC305 (RoHS)

4709

BGA

–40°C to 125°C

LTM4709HY#PBF

SAC305 (RoHS)

4709

BGA

–40°C to 150°C

• Contact the factory for parts specified with wider operating temperature

ranges. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• This product is not recommended for second side reflow.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

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