PM6681A

Package mechanical data

9/12

4

Package mechanical data

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Table 2.

VFQFPN 5x5x1.0 32L Pitch 0.50

Dim.

Databook (mm)

Min

Typ

Max

A0.8

0.9

1

A1

0

0.02

0.05

A3

0.2

b

0.18

0.25

0.3

D4.85

5

5.15

D2

E4.85

5

5.15

E2

e0.5

L

0.3

0.4

0.5

ddd

0.05

Table 3.

Exposed pad variations

1.

VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. Very thin:

A = 1.00mm Max.

2.

Dimensions D2 & E2 are not in accordance with JEDEC.

E2

Min

Typ

Max

Min

Typ

Max

2.90

3.10

3.20

2.90

3.10

3.20