uPI Semiconductor Corp., http://www.upi-semi.com

Rev. F03, File Name: uP6281-DS-F0300

uP6281

10

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.

Package Information

WDFN3x3-8L Package

1

4

58

Recommended Solder Pitch and Dimensions

0.20 - 0.35

0.50 BSC

2.90 - 3.10

0.30 - 0.45

1.95 - 2.50

0.00 - 0.05

0.20 REF

1.95 - 2.50

0.20 - 0.35

0.50 BSC