2000 Jan 04

7

Philips Semiconductors

Product specification

UHF amplifier module

BGY2016

PACKAGE OUTLINE

UNIT

Q

bp

Z

c

e

U2

U1

U

Fp

q

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

99-02-06

IEC

JEDEC

EIAJ

mm

4.0

3.8

0.56

0.46

A

9.5

9.0

0.3

0.2

D

30.1

29.9

E

18.6

18.4

12.8

12.6

4.1

3.9

40.74

40.54

2.54

e1

17.78

3.25

3.15

L

6.5

6.1

7.75

7.55

15.4

15.2

48.0

48.4

0.3

0.25

vw

0.1

y

DIMENSIONS (mm are the original dimensions)

SOT365A

0

10

20 mm

scale

Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads

SOT365A

p

U2

F

A

U1

U

D

q

E

L

y

Q

c

v A

A

bp

Z

23

4

1

e1

e

e