Figure 13. ST4SIM-200M PCB integration recommendations

GND

SWIO

RST

N/C

I/O

VCC

RST

CLK

N/C

I/O

CLK

GND

VCC

Modem

ST4SIM-200-M

C1

R1

VCC

Note:

C1 decoupling capacitors as recommended in Figure 6. Recommended filtering capacitors on VCC.

R1: 20 kΩ external pull-up recommended on I/O.

7.1.3

Tape and reel packing

Surface-mount packages is available in tape and reel packing . The reels have a 13" nominal diameter and

contain 4000 devices each.

Reels are in, either antistatic or conductive, plastic with a black conductive cavity tape. The cover tape is

transparent antistatic or conductive.

The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the same side as the

sprocket holes in the tape.

The STMicroelectronics Tape & Reel specifications are compliant to the EIA 481-A standard specification.

Table 5. Packing on tape and reel

Package

Description

Tape width

Tape pitch

Reel diameter

Quantity per reel

VFDFPN8

5 x 6

Flat package, no lead 5 x 6 mm.

12 mm

8 mm

13 in.

4000

ST4SIM-200M

VFDFPN8 package information

DB4082 - Rev 5

page 15/26