7

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

7.1

VFDFPN8 package information

VFDFPN8 is a "very thin fine pitch dual flat no lead package" with wettable flanks, dimensions 5 × 6 mm and

1.27 mm pitch.

This package is compliant with JEDEC J-STD-020D and MSL 1 specifications.

It is also compliant with MFF2 (Machine-to-machine form factor 2) ETSI specifications (M2M UICC - TS102.671).

Figure 7. VFDFPN8 - outline

1

2

Top view

Side view

Bottom view

Seatingplane

A

A1

A3

(Datum B)

L

D2

(Datum A)

D

D

7

8

E2

Pin 1 IDR0.200

K

2

1

(0.05)

(0.10)

(0.30)

(0.40)

(0.05)

Section “D–D”Scale: 3:1

A06D_ME_V1

Note:

Drawing is not to scale.

ST4SIM-200M

Package information

DB4082 - Rev 5

page 12/26