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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST7260 датащи(PDF) 103 Page - STMicroelectronics |
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ST7260 датащи(HTML) 103 Page - STMicroelectronics |
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103 / 117 page  ST7260 103/117 14 PACKAGE CHARACTERISTICS In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level in- terconnect. The category of second Level Inter- connect is marked on the package and on the in- ner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK speci- fications are available at: www.st.com 14.1 PACKAGE MECHANICAL DATA Figure 64. 24-Pin Plastic Small Outline Package, 300-mil Width Dim. mm inches Min Typ Max Min Typ Max A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.020 C 0.23 0.32 0.009 0.013 D 15.20 15.60 0.599 0.614 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.00 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 α 0° 8° 0° 8° L 0.40 1.27 0.016 0.050 Number of Pins N 24 C h x 45× L a A A1 e B D H E |
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