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LM3207TL датащи(PDF) 16 Page - National Semiconductor (TI) |
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LM3207TL датащи(HTML) 16 Page - National Semiconductor (TI) |
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16 / 19 page ![]() Application Information (Continued) LDO CAPACITOR SELECTION The output capacitor should be connected between the LDO output and a good ground connection. This capacitor must be selected within specified capacitance range and have sufficiently low ESR. The ESR of the capacitor is generally a major factor in LDO stability. Refer to manufacturer ESR curves for more detail. Table 1 suggests acceptable capaci- tors and their suppliers. TABLE 1. Suggested capacitors and their suppliers Model Vendor C1005X5R1A104KT, 100nF, 10V TDK C1005X5R0J224KT, 220nF, 6.3V TDK INDUCTOR SELECTION A 3.3µH inductor with saturation current rating over 1200mA and low inductance drop at the full DC bias condition is recommended for almost all applications. The inductor’s DC resistance should be less than 0.2 Ω for good efficiency. For low dropout voltage, lower DCR inductors are advanta- geous. The lower limit of acceptable inductance is 1.7µH at 1200mA over the operating temperature range. Full attention should be paid to this limit, because some small inductors show large inductance drops at high DC bias. These can not be used with the LM3207. Table 2 suggests some inductors and suppliers. TABLE 2. Suggested inductors and their suppliers Model Size (WxLxH) [mm] Vendor NR3015T3R3M 3.0 x 3.0 x 1.5 Taiyo-Yuden DO3314-332MXC 3.3 x 3.3 x 1.4 Coilcraft MIPW3226D3R0M 3.2 x 2.6 x 1.0 FDK If a smaller inductance inductor is used in the application, the LM3207 may become unstable during line and load tran- sients and V CON transient response times may be affected. For low-cost applications, an unshielded bobbin inductor is suggested. For noise critical applications, a toroidal or shielded-bobbin inductor is recommended. A good practice is to layout the board with footprints accommodating both types for design flexibility. This allows substitution of a low- noise toroidal inductor, in the event that noise from low-cost bobbin models is unacceptable. Saturation occurs when the magnetic flux density from current through the windings of the inductor exceeds what the inductor’s core material can support with a corresponding magnetic field. This can result in poor efficiency, regulation errors or stress to DC-DC con- verter like the LM3207. DC-DC CONVERTER CAPACITOR SELECTION The LM3207 is designed with a ceramic capacitor for its input and output filters. Use a 10µF ceramic capacitor for input and a 4.7µF ceramic capacitor for output. They should maintain at least 50% capacitance at DC bias and tempera- ture conditions. Ceramic capacitors types such as X5R, X7R are recommended for both filters. These provide an optimal balance between small size, cost, reliability and performance for cell phones and similar applications. Table 3 lists sug- gests acceptable part numbers and their suppliers. DC bias characteristics of the capacitors must be considered when selecting the voltage rating and case size of the capacitor. If it is necessary to choose a 0603-size capacitor for V IN, the operation of the LM3207should be carefully evaluated on the system board. Output capacitors with smaller case sizes mitigate piezo electric vibrations when the output voltage is stepped up and down at fast rates. However, they have a larger percentage drop in value with dc bias. Use of multiple 2.2µF or 1µF capacitors in parallel may also be considered. TABLE 3. Suggested capacitors and their suppliers Model Vendor 0805ZD475KA, 4.7µF, 10V Taiyo-Yuden C1608X5R0J475M, 4.7uF, 6.3V TDK C1608X5R0J106M, 10µF, 6.3V TDK C2012X5R0J106M, 10uF, 6.3V TDK C2012X5R1A475M, 4.7uF, 6.3V TDK The input filter capacitor supplies AC current drawn by the PFET switch of the LM3207 in the first part of each cycle and reduces the voltage ripple imposed on the input power source. The output filter capacitor absorbs the AC inductor current, helps maintain a steady output voltage during tran- sient load changes and reduces output voltage ripple. These capacitors must be selected with sufficient capacitance and sufficiently low ESR (Equivalent Series Resistance) to per- form these functions. The ESR of the filter capacitors is generally a factor in voltage ripple. EN PIN CONTROL Drive the EN and EN LDO pins using the system controller to turn the LM3207 ON and OFF. Use a comparator, Schmidt trigger or logic gate to drive the EN and EN LDO pins. Set EN high (>1.2V) for normal operation and low (<0.5V) for a 0.01µA (typ.) shutdown mode. Set EN low to turn off the LM3207 during power-up and under voltage conditions when the power supply is less than the 2.7V minimum operating voltage. The part is out of regulation when the input voltage is less than 2.7V. The LM3207 is designed for mobile phones where the system controller controls operation mode for maximizing battery life and requirements for small package size outweigh the addi- tional size required for inclusion of UVLO (Under Voltage Lock-Out) circuitry. Micro SMD PACKAGE ASSEMBLY AND USE Use of the Micro SMD package requires specialized board layout, precision mounting and careful re-flow techniques, as detailed in National Semiconductor Application Note 1112. Refer to the section Surface Mount Technology (SMD) As- sembly Considerations. For best results in assembly, align- ment ordinals on the PC board should be used to facilitate placement of the device. The pad style used with Micro SMD package must be the NSMD (non-solder mask defined) type. This means that the solder-mask opening is larger than the pad size. This prevents a lip that otherwise forms if the solder-mask and pad overlap, from holding the device off the surface of the board and interfering with mounting. See Application Note 1112 for specific instructions. The 9-Bump package used for LM3207 has 300 micron solder balls and requires 10.82mil pads for mounting the circuit board. The trace to each pad should enter with a 90˚ entry angle to prevent debris from being caught in deep corners. Initially, the trace to each pad should be 6-7mil www.national.com 16 |
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