FN8942 Rev.3.0

Page 8 of 25

Jul 30, 2021

ISL70321SEH, ISL73321SEH

2. Specifications

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

2.3

Recommended Operating Conditions

Parameter

Minimum

Maximum

Unit

VDD

GND - 0.3

GND + 16

V

ENX, KILL, DONE (VDD < 5V)

GND - 0.3

GND + 12

V

ENX, KILL, DONE (VDD ≥ 5V)

GND - 0.3

GND + 16

V

VDD in Ion Beam

GND - 0.3

GND + 14.7

V

VCC5

6.5

V

200 (IOUT)mA

VREF

Do Not Load, loading lowers the VREF

UP, VMX, PGTMR, TDLY, INIT

GND - 0.3

VCC5 + 0.3

V

ENX, KILL, DONE, INIT

-15 (Pull Down Current)

mA

ESD Rating

Value

Unit

Human Body Model (Tested per MIL-STD-883 TM3015.7)

8

kV

Machine Model (Tested per JESD22-A115C)

300

V

Charged Device Model (Tested per JS-002-2014)

1

kV

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may

adversely impact product reliability and result in failures not covered by warranty.

Thermal Resistance (Typical)

JA (°C/W)

JC (°C/W)

CDFP Package K18.B (Notes 6, 7)73

3

Notes:

6.

JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379.

7. For

JC, the “case temp” location is the center of the package underside.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

+150

°C

Storage Temperature Range

-65

+150

°C

Parameter

Minimum

Maximum

Unit

Temperature

-55

+125

°C

VDD

3.3 ±10%

12 ±10%

V

Timer Delay Resistors

10

100

kΩ

VDD Capacitor

≥100

-

nF

VREF Capacitor

220 ±20%

220 ±20%

nF

VCC5 Capacitor

470 ±20%

470 ±20%

nF