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ISL70321SEHF/PROTO датащи(PDF) 21 Page - Renesas Technology Corp |
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ISL70321SEHF/PROTO датащи(HTML) 21 Page - Renesas Technology Corp |
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21 / 26 page ![]() FN8942 Rev.3.0 Page 21 of 25 Jul 30, 2021 ISL70321SEH, ISL73321SEH 6. Die and Assembly Characteristics 6. Die and Assembly Characteristics Table 2. Die and Assembly Related Information Die Information Dimensions 3300µm x 6600µm (130 mils x 260 mils) Thickness: 483µm ± 25.4µm (19 mils ± 1mil) Interface Materials Glassivation Type: Silicon Oxide and Silicon Nitride Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm Top Metallization Type: AlCu (99.5%/0.5%) Thickness: 2.7µm ±0.4µm Backside Finish Silicon Process 0.6µM BiCMOS Junction Isolated Assembly Information Substrate Potential GND Additional Information Worst Case Current Density <2 x 105 A/cm2 Transistor Count 4003 Weight of Packaged Device 0.79 grams (typical) - K18.B Package Lid Characteristics Finish: Gold Lid Potential: GND |
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