January 28, 2014

2

IDTP9167

Advanced Datasheet

ABSOLUTE MAXIMUM RATINGS

These absolute maximum ratings are stress ratings only. Stress greater than those listed below may cause permanent

damage to the device. Functional operation of the IDTP9167 at absolute maximum ratings is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect long-term reliability.

Table 1 – Absolute Maximum Ratings. All voltages are referred to ground, unless otherwise noted.

PINS

MAXIMUM

RATING

UNITS

PVIN

-0.3 to 13.2

V

VSYS

-0.3 to 6.0

V

DIF, DIO

-0.3 to 2.2

V

RSET

-0.3 to 6.0

V

VPG

-0.3 < PVIN-VPG < 6.0

V

Table 2 - Package Thermal Information

SYMBOL

DESCRIPTION

RATING

UNITS

θJA

Thermal Resistance Junction to Ambient

36

°

C/W

θJC

Thermal Resistance Junction to EPAD

7

°

C/W

ΨJT

Junction to Top of Case

10

°

C/W

TJ

Junction Temperature

-40 to +125

°

C

TA

Ambient Operating Temperature

-40 to +85

°

C

TSTG

Storage Temperature

-55 to +150

°

C

TLEAD

Lead Temperature (soldering, 10s)

+300

°

C

Note 1

: The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will

result in excessive die temperature, and the device will enter thermal shutdown.

Note 2

: The thermal rating is calculated based on a JEDEC standard 4-layer board with dimensions 101 mm x 101 mm in still air conditions with 2 oz.

copper on the all four layers, 10 thermal Vias at 889 µm pitch, 508 µm drills connecting the EPAD, and an extended PCB pad of 760 µm.

Note 3

: Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.

Table 3 – Absolute Maximum Ratings

SYMBOL

PARAMETER

RATING

UNIT

ESD Rating

(HBM) Human Body Model

±2000

V

(CDM) Charge Device Model (all pins)

±500