HCTS540MS

FN2232 Rev 2.00

Page 10 of 10

September 1995

Die Characteristics

DIE DIMENSIONS:

101 x 85mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCTS540MS

NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS540 is TA14455A.

OE1

(1)

A0

(2)

A1 (3)

A2 (4)

A4 (6)

A6 (8)

A7

(9)

GND

(10)

Y6

(12)

(14) Y4

(16) Y2

(17) Y1

(18) Y0

OE2

(19)

VCC

(20)

(13) Y5

(15) Y3

Y7

(11)

A5 (7)

A3 (5)