HCTS299MS

FN3069 Rev 1.00

Page 12 of 12

August 1995

Die Characteristics

DIE DIMENSIONS:

123 x 94 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCTS299MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS299 is TA14480A.

(17) Q7

(16) I/O7

(15) I/O5

(14) I/O3

(13) I/O1

OE2 (3)

I/O6 (4)

I/O4 (5)

I/O2 (6)

I/O0 (7)

Q0 (8)

(18) DS7