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HCS74MS датащи(PDF) 4 Page - Renesas Technology Corp

номер детали HCS74MS
подробное описание детали  Radiation Hardened Dual-D Flip-Flop with Set and Reset
PDF  9 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HCS74MS датащи(HTML) 4 Page - Renesas Technology Corp

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HCS74MS
FN2142 Rev 2.00
Page 4 of 9
September 1995
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
(NOTES 1, 2)
CONDITIONS
GROUP
A SUB-
GROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
CP to Q, Q
TPHL
VCC = 4.5V
9
+25oC
2
27
ns
10, 11
+125oC, -55oC
2
32
ns
TPLH
VCC = 4.5V
9
+25oC
2
26
ns
10, 11
+125oC, -55oC
2
31
ns
S to Q
TPLH
VCC = 4.5V
9
+25oC
2
26
ns
10, 11
+125oC, -55oC
2
31
ns
S to Q
TPHL
VCC = 4.5V
9
+25oC
2
27
ns
10, 11
+125oC, -55oC
2
32
ns
R to Q
TPHL
VCC = 4.5V
9
+25oC
2
24
ns
10, 11
+125oC, -55oC
2
29
ns
R to Q
TPLH
VCC = 4.5V
9
+25oC
2
25
ns
10, 11
+125oC, -55oC
2
30
ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500
, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Capacitance Power
Dissipation
CPD
VCC = 5.0V, f = 1MHz
1
+25oC
-
53
pF
1
+125oC, -55oC
-
55
pF
Input Capacitance
CIN
VCC = 5.0V, f = 1MHz
1
+25oC
-
10
pF
1
+125oC, -55oC
-
10
pF
Output Transition
Time
TTHL
TTLH
VCC = 4.5V
1
+25oC
-
15
ns
1
+125oC, -55oC
-
22
ns
Max Operating
Frequency
FMAX
VCC = 4.5V
1
+25oC30
-
MHz
1
+125oC, -55oC20
-
MHz
Data to CP Set-up
Time
TSU
VCC = 4.5V
1
+25oC11
-
ns
1
+125oC, -55oC12
-
ns
Hold Time
TH
VCC = 4.5V
1
+25oC3
-
ns
1
+125oC, -55oC3
-
ns
Removal Time
R, S to CP
TREM
VCC = 4.5V
1
+25oC5
-
ns
1
+125oC, -55oC6
-
ns
Pulse Width R, S
TW
VCC = 4.5V
1
+25oC14
-
ns
1
+125oC, -55oC16
-
ns
Pulse Width CP
TW
VCC = 4.5V
1
+25oC14
-
ns
1
+125oC, -55oC16
-
ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.



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