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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST33TPHF2XI2C датащи(PDF) 17 Page - STMicroelectronics |
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ST33TPHF2XI2C датащи(HTML) 17 Page - STMicroelectronics |
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17 / 30 page  6.2 Thermal characteristics of packages The table below provides the thermal characteristics of the VFQFPN32 package. Table 12. Thermal characteristics Parameter Symbol Value Recommended operating temperature range Ambient temperature TA −40 to 105 °C Case temperature TC - Junction temperature TJ −43 to 108 °C Absolute maximum junction temperature - 125 °C Maximum power dissipation - 63 mW Theta-JA, -JB and -JC Junction to ambient thermal resistance θJA(1) 35.8 at 0 lfpm (2) Junction to case thermal resistance θJC 1.48 at 0 lfpm(2) Junction to board thermal resistance θJB 13.9 at 0 lfpm(2) 1. According to JESD51-2 (still air condition). 2. Linear feet per minute. ST33TPHF2XI2C Thermal characteristics of packages DS14167 - Rev 1 page 17/30 |
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