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SM30T28CAY датащи(PDF) 5 Page - STMicroelectronics |
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SM30T28CAY датащи(HTML) 5 Page - STMicroelectronics |
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5 / 16 page ![]() Figure 9. Leakage current versus junction temperature 1 10 100 1000 10000 25 50 75 100 125 150 175 IR(nA) Tj(°C) VR = VRM VRM < 10 V VRM ≥ 10 V Figure 10. Peak forward voltage drop versus peak forward current 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 IF (A) VF (V) single pulse Tj = 25 °C Tj = 175 °C Tj = 150 °C Figure 11. Thermal impedance junction to ambient versus pulse duration 1 10 100 1000 0.1 1 10 100 1000 Zth(j-a) (°C/W) tp (s) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness Figure 12. Thermal resistance junction to ambient versus copper area under each lead 0 20 40 60 80 100 120 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Rth(j-a) (°C/W) SCu (cm²) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness Figure 13. ISO7637-2 pulse 1 response (VS = -150 V) with 12 V battery Figure 14. ISO7637-2 pulse 2a response (VS = 112 V) with 12 V battery SM30TxxAY, SM30TxxCAY Characteristics (curves) DS8599 - Rev 12 page 5/16 |
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