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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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L8150 датащи(PDF) 35 Page - STMicroelectronics |
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L8150 датащи(HTML) 35 Page - STMicroelectronics |
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35 / 37 page  L8150 Package information 35/37 9 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com. Figure 36. SO-28 Mechanical data & package dimensions SO-28 DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.65 0.104 a1 0.1 0.3 0.004 0.012 b 0.35 0.49 0.014 0.019 b1 0.23 0.32 0.009 0.013 C 0.5 0.020 c1 45 ° (typ.) D 17.7 18.1 0.697 0.713 E 10 10.65 0.394 0.419 e 1.27 0.050 e3 16.51 0.65 F 7.4 7.6 0.291 0.299 L 0.4 1.27 0.016 0.050 S8 ° (max.) OUTLINE AND MECHANICAL DATA |
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