2004 Dec 22

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Philips Semiconductors

Product specification

Universal LCD driver for low

multiplex rates

PCF8576D

Bare die

 All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for

a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be

separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips

Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.

Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems

after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify

their application in which the die is used.

Philips. This specification can be ordered using the code 9398 393 40011.