www.austriamicrosystems.com

Revision 1.00

13 - 15

AS1152

Data Sheet

Board Layout

10 Package Drawings and Markings

Figure 23. 16-pin TSSOP Package

Symbol

Min

Typ

Max

Notes

A-

-

1.10

1,2

A1

0.05

-

0.15

1,2

A2

0.85

0.90

0.95

1,2

L

0.50

0.60

0.75

1,2

R0.09

-

-

1,2

R1

0.09

-

-

1,2

b

0.19

-

0.30

1,2,5

b1

0.19

0.22

0.25

1,2

c

0.09

-

0.20

1,2

c1

0.09

-

0.16

1,2

θ1

0º

-

8º

1,2

L1

1.0REF

1,2

aaa

0.10

1,2

bbb

0.10

1,2

ccc

0.05

1,2

ddd

0.20

1,2

e

0.65BSC

1,2

θ212ºREF

1,2

θ312ºREF

1,2

Variations

D

4.90

5.00

5.10

1,2,3,8

E1

4.30

4.40

4.50

1,2,4,8

E

6.4BSC

1,2

e

0.65BSC

1,2

N

16

1,2,6

Notes:

1. All dimensions are in millimeters; angles in degrees.

2. Dimensioning and tolerancing per ASME Y14.5M – 1994.

3. Dimension D does not include mold flash, protrusions, or gate

burrs. Mold flash, protrusions, and gate burrs shall not exceed

0.15mm per side.

4. Dimension E1 does not include interlead flash or protrusion.

Interlead flash or protrusions shall not exceed 0.25mm per

side.

5. Dimension b does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08mm total in excess of the b

dimension at maximum material condition. Dambar cannot be

located on the lower radius of the foot.

6. Terminal numbers are for reference only.

7. Datums A and B to be determined at datum plane H.

8. Dimensions D and E1 are to be determined at datum plane H.

9. This dimension applies only to variations with an even number

of leads per side.

10. Cross section A-A to be determined at 0.10 to 0.25mm from

the leadtip.