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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32H757AI датащи(PDF) 232 Page - STMicroelectronics |
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STM32H757AI датащи(HTML) 232 Page - STMicroelectronics |
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232 / 251 page  Package information STM32H757xI 232/251 DS12931 Rev 1 Figure 73. WLCSP156 bump recommended footprint 1. Dimensions are expressed in millimeters. Table 132. WLCSP156 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 3rd decimal digits. Min Typ Max Min Typ Max A- - 0.58 - - 0.023 A1 - 0.17 - - 0.006 - A2 - 0.38 - - 0.015 - A3 - 0.025(2) 2. Back side coating. Nominal dimension rounded to the 3rd decimal place resulting from process capability. -- 0.001 - b 0.21 0.24 0.27 0.008 0.009 0.011 D 4.94 4.96 4.98 0.193 0.195 0.196 E 4.62 4.64 4.66 0.181 0.182 0.183 e1 - 4.20 - - 0.014 - e2 - 3.85 - - 0.165 - e - 0.35 - - 0.152 - F - 0.380(3) 3. Calculated dimensions are rounded to 3rd decimal place. -- 0.015 - G - 0.395(3) -- 0.015 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 A086_WLCSP156_FP_V1 Dpad Dsm |
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