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STM32H757AI датащи(PDF) 231 Page - STMicroelectronics |
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STM32H757AI датащи(HTML) 231 Page - STMicroelectronics |
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231 / 251 page ![]() DS12931 Rev 1 231/251 STM32H757xI Package information 249 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at www.st.com. ECOPACK® is an ST trademark. 7.1 WLCSP156 package information WLCSP156 is a 156-bump, 4.96 x 4.64 mm, 0.35 mm pitch, wafer level chip scale package. Figure 72. WLCSP156 package outline 1. Drawing is not to scale. A086_WLCSP156_ME_V1 e e D E e2 e1 G F A1 ball location D E BOTTOM VIEW TOP VIEW A3 b A2 A2 A A1 bbb Z Detail A A1 ccc Z Z ZX Y ddd DETAIL A ROTATED 90 SEATING PLANE FRONT VIEW SIDE VIEW BUMP |
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