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PIC16F684 датащи(PDF) 61 Page - Microchip Technology |
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PIC16F684 датащи(HTML) 61 Page - Microchip Technology |
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61 / 78 page ![]() 2006-2012 Microchip Technology Inc. DS51292T-page 61 Appendix A. Debug Header Target Footprints INTRODUCTION To connect a debug header directly to a target board (without the use of a transition socket) the following information will be helpful. • DIP Device Footprints • TQFP/PLCC Device Footprints DIP DEVICE FOOTPRINTS DIP device adapter footprints shown will accept adapter plugs like Samtec series APA plugs. These plugs can be soldered in place during development/emulation and eliminate the need for any other sockets. FIGURE 16: DIP FOOTPRINT TQFP/PLCC DEVICE FOOTPRINTS TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during development/emulation and eliminate the need for any other sockets. FIGURE 17: SINGLE-ROW TQFP/PLCC FOOTPRINT 0.100 C UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing of DIP is 40-pin. DIP C 8-Pin 0.300 14-Pin 0.300 18-Pin 0.300 20-Pin 0.300 28-Pin 0.300 40-Pin 0.600 0.028 DIA PLATED-THRU HOLES 0.050 0.800 0.800 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing of device is 44-pin TQFP/PLCC. 0.028 DIA PLATED-THRU HOLES |
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