APR34709

Document number: DS41354 Rev. 5 - 3

4 of 13

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June 2022

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APR34709

Absolute Maximum Ratings (Note 4)

Symbol

Parameter

Value

Unit

VCC

Supply Voltage

-0.3 to 28

V

VDET, VDRAIN

Voltage at VDET, DRAIN Pins (Note 5)

-2 to 60

V

VAREF, VDRISR

Voltage at AREF, DRISR Pins

-0.3 to 7

V

ID

Continuous Drain Current

20

A

IDM

Pulsed Drain Current

80

A

PD

Power Dissipation at TA = +25°C

2.2

W

θJA

Thermal Resistance (Junction to Ambient)

(Note 6)

54

°C/W

θJC

Thermal Resistance (Junction to Case)

(Note 6)

11

°C/W

TJ

Operating Junction Temperature

+150

°C

TSTG

Storage Temperature

-65 to +150

°C

TLEAD

Lead Temperature (Soldering, 10s)

+300

°C

Notes:

4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.

Exposure to Absolute Maximum Ratings for extended periods can affect device reliability.

5. VDET pin is ESD sensitive.

6. Test condition: Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch2 cooling area.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VCC

Supply Voltage

3.3

16

V

TA

Ambient Temperature

-40

+85

°C