L9177ATR datasheet(47/55 Pages) STMICROELECTRONICS

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Notes

Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

The Top package body size may be smaller than the bottom package size up to 0.15 mm.

Datum A-B and D to be determined at datum plane H.

To be determined at seating datum plane C.

Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25

mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch.

Details of pin 1 identifier are optional but must be located within the zone indicated.

All Dimensions are in millimeters.

No intrusion allowed inwards the leads.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead

width to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower

radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5

mm pitch packages.

10. Exact shape of each corner is optional.

11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

12. A1 is defined as the distance from the seating plane to the lowest point on the package body.

13. Dimensions D2 and E2 show the maximum exposed metal area on the package surface where the exposed

pad is located (if present). It includes all metal protrusions from exposed pad itself. Type of exposed pad is

variable depending on leadframe pad design (T1, T2, T3), as shown in the figure below. End user should

verify D2 and E2 dimensions according to specific device application.

14. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of exposed pad which is

guaranteed to be free from resin flashes/bleeds, bordered by internal edge of inner groove.

15. The optional exposed pad is generally coincident with the top or bottom side of the package and not allowed

to protrude beyond that surface.

16. “N” is the number of terminal positions for the specified body size.

17. For Tolerance of Form and Position see Table.

18. Critical dimensions:

Stand-off

Overall width

Lead coplanarity

L9177A

TQFP 10x10 64L exposed pad down package information

DS12175 - Rev 5

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L9177ATR датащи(PDF) 47 Page - STMicroelectronics