9.4.2.1 Thermal Considerations

The maximum IC junction temperature should be restricted to 125°C under normal operating conditions.

Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal

to PD(max). The maximum-power-dissipation limit is determined using Equation 20.

A

D(max)

JA

125

T

P

R

T

(20)

where

• TA is the maximum ambient temperature for the application.

• RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table.

The TPS61376 comes in a thermally-enhanced VQFN package. The real junction-to-ambient thermal resistance

of the package greatly depends on the PCB type, layout, and thermal pad connection. Using thick PCB copper

and soldering the thermal pad to a large ground plate enhance the thermal performance. Using more vias

connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves

the thermal capability.

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TPS61376

SLVSGQ1A – JANUARY 2022 – REVISED SEPTEMBER 2022

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