9.2.3 Application Curves (continued)

Time Scale 200 s/div

VOUT(AC)

300mV/div

IOUT

500mA/div

VIN = 3.3 V

VOUT = 12 V

Figure 9-8. Load Transient (IOUT = 0.1 to 0.5 A)

Time Scale 200 s/div

VOUT(AC)

300mV/div

IOUT

500mA/div

VIN = 8.4 V

VOUT = 12 V

Figure 9-9. Load Transient (IOUT = 0.1 to 0.5 A)

Time Scale 200 s/div

VOUT(AC)

200mV/div

IL

1A/div

VIN

3V/div

VOUT = 12 V

IOUT = 0.5 A

Figure 9-10. Line Transient (VIN = 3.3 V to 8.4 V)

9.3 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 2.9 V to 23 V. This input supply

must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk

capacitance can be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic or

tantalum capacitor with a value of 47 μF.

9.4 Layout

9.4.1 Layout Guidelines

As for all switching power supplies, especially those running at high switching frequency and high current, layout

is an important design step. If the layout is not carefully done, the regulator can suffer from instability and noise

problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of high-frequency

noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the length

and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to

minimize interplane coupling.

The input capacitor needs to be close to the VIN pin and PGND pin in order to reduce the Iinput supply ripple.

The power paths of SW, D1,output capacitor and PGND should be as small as possible, in order to reduce

parasitic inductance.

The layout should also be done with well consideration of the thermal as this is a high power density device. The

VP, SW, VOUT and PGND pins that improves the thermal capabilities of the package should be soldered with

the large polygon, using thermal vias underneath the SW pin could improve thermal performance.

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TPS61376

SLVSGQ1A – JANUARY 2022 – REVISED SEPTEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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