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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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L99H02 датащи(PDF) 42 Page - STMicroelectronics |
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L99H02 датащи(HTML) 42 Page - STMicroelectronics |
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42 / 51 page  Package and packing information L99H02 42/51 DS12547 Rev 6 5 Package and packing information 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 5.2 Package thermal data Figure 12. PowerSSO-36 Rthj-amb vs. PCB copper area in open box free air condition Note: In Figure 12 the Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias FR4 area = 129 mm x 60 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side). Copper areas: from minimum pad layout to 8 cm2). 35 40 45 50 55 60 65 024 68 10 RTHj_amb(°C/W) PCB Cu heatsink area (cm^2) |
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