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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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OPA310 датащи(PDF) 6 Page - Texas Instruments |
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OPA310 датащи(HTML) 6 Page - Texas Instruments |
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6 / 55 page  1 OUT1 8 V+ 2 IN1± 7 OUT2 3 IN1+ 6 IN2± 4 V± 5 IN2+ Not to scale Figure 6-6. OPA2310 D, DDF, DGK, and PW Package 8-Pin SOIC, SOT-23-THIN, VSSOP, and TSSOP (Top View) 1 OUT1 8 V+ 2 IN1± 7 OUT2 3 IN1+ 6 IN2± 4 V± 5 IN2+ Not to scale Thermal Pad Connect exposed thermal pad to V–. See Section 8.3.10 for more information. Figure 6-7. OPA2310 DSG Package 8-Pin WSON with Exposed Thermal Pad (Top View) Table 6-3. Pin Functions: OPA2310 PIN I/O DESCRIPTION NAME NO. IN1– 2 I Inverting input, channel 1 IN1+ 3 I Noninverting input, channel 1 IN2– 6 I Inverting input, channel 2 IN2+ 5 I Noninverting input, channel 2 OUT1 1 O Output, channel 1 OUT2 7 O Output, channel 2 V– 4 I Negative (low) supply or ground (for single-supply operation) V+ 8 I Positive (high) supply OPA310, OPA2310, OPA4310 SBOSAA1C – APRIL 2022 – REVISED SEPTEMBER 2022 www.ti.com 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: OPA310 OPA2310 OPA4310 |
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