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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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L6364 датащи(PDF) 52 Page - STMicroelectronics |
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L6364 датащи(HTML) 52 Page - STMicroelectronics |
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52 / 60 page  25 CSP19 Package and Packaging Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 28. CSP19 Mechanical drawings Table 35. CSP19 Dimensions [mm] SYMBOL MIN. TYP. MAX. A 0.414 0.444 0.474 A1 0.179 0.194 0.209 A2 0.225 0.250 0.275 b 0.239 0.269 0.299 D 2.507 2.537 2.567 E 2.507 2.537 2.567 D1 1.8 BSC E1 1.5 BSC eD 0.45 BSC eE 0.50 BSC SD 0.006 BSC SE 0.172 BSC fD1 0.374 BSC fD2 0.363 BSC fE1 0.441 BSC L6364 CSP19 Package and Packaging Mechanical Data DS13363 - Rev 4 page 52/60 |
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