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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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L6364 датащи(PDF) 49 Page - STMicroelectronics |
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L6364 датащи(HTML) 49 Page - STMicroelectronics |
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49 / 60 page  24 QFN20L Package and Packing Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 25. QFN20L mechanical drawings Table 33. QFN20L Dimensions [mm] SYMBOL MIN. TYP. MAX. A 0.80 0.90 1.00 A1 0.02 A2 0.65 1.00 A3 0.25 b 0.18 0.23 0.30 D 3.85 4.00 4.15 D2 2.60 2.70 2.80 E 3.85 4.00 4.15 E2 2.60 2.70 2.80 e 0.45 0.50 0.55 L 0.30 0.40 0.50 ddd 0.08 L6364 QFN20L Package and Packing Mechanical Data DS13363 - Rev 4 page 49/60 |
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