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Vishay Electro-Films

Revision: 14-Sep-2018

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Document Number: 61112

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Custom Substrates - Metal Via / Multilayer / Lumped Element

FEATURES

• Plated or filled via technology

• Mulitlayer and overcoat patterning

• Lumped element custom substrates

• TaN and NiCr resistor films

• Metallization on 1,2, or 4 surfaces

• Various substrate materials

• Sputtered / plated metal systems

• Custom sizes from 0.020" x 0.020" to 4.000" x 4.000"

• Quick delivery available

APPLICATIONS

Vishay EFI custom interconnect substrates are used in military, aerospace, hybrid circuit, telecommunications, microwave, and

industrial applications. These custom interconnect substrates are manufactured to be used in heat transfer connectors, top to

bottom connectors, and RF / microwave designs. Surface connections can be made by plated thru-holes, edge wraps, or filled

via technologies. Custom cutouts of various sizes and shapes can also be created and used to fit into almost any size and

shape. The custom interconnect substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment

and manufacturing technology. The custom interconnect substrates are 100 % electrically tested (when applicable) and visually

inspected to MIL-STD-883, method 2032 class H or K.

THIN FILM DESIGN GUIDELINES

SUBSTRATE MATERIALS

METAL SYSTEM AND CONDUCTOR PATTERNING

THIN FILM RESISTORS

For thin film resistors and their properties and design guidelines, please reference datasheet:

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PROTECTIVE COATINGS

For protective coatings or overcoat options and their properties and design guidelines, please reference datasheet PSS:

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