TUSB1104 datasheet(6/55 Pages) TI

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage Range

VCC

–0.3

Voltage Range at any input or output pin

Differential voltage between positive and negative

inputs

-2.5

2.5

Voltage at differential inputs

–0.5

CMOS Inputs

–0.5

Maximum junction temperature, TJ

TUSB1104

105

°C

TUSB1104I

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Main power supply

3.0

3.3

3.6

Main supply ramp requirement

0.1

V(I2C)

Supply that external resistors are pulled up to for both SDA and SCL

pins

1.7

3.6

V(PSN)

Supply Noise on VCC pins (less than 4MHz)

mVpp

TUSB1104 Operating free-air temperature

°C

TUSB1104I Operating free-air temperature

-40

°C

5.4 Thermal Information

THERMAL METRIC(1)

TUSB1104

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

31.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

21.8

°C/W

RθJB

Junction-to-board thermal resistance

12.2

°C/W

ψJT

Junction-to-top characterization parameter

0.3

°C/W

ψJB

Junction-to-board characterization parameter

12.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.3

°C/W

(1)

For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application

report.

TUSB1104

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