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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L011E4 датащи(PDF) 101 Page - STMicroelectronics |
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STM32L011E4 датащи(HTML) 101 Page - STMicroelectronics |
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101 / 119 page  DocID027973 Rev 5 101/119 STM32L011x3/4 Package information 115 Figure 39. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale package recommended footprint G - 0.235 - - 0.0093 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 70. WLCSP25 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 69. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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