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TMP114 датащи(PDF) 39 Page - Texas Instruments |
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TMP114 датащи(HTML) 39 Page - Texas Instruments |
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39 / 50 page ![]() 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information The TMP114 can be operated with a two-wire I2C or SMBus compatible interface and features the ability to operate with a 1.2-V bus voltage regardless of the VDD voltage. The TMP114 features a uniquely small z-height of 0.15 mm designed for low clearance and space-constrained applications. The device also features an integrated optional CRC checksum for ensuring data integrity during communication. 9.2 Separate I2C Pullup and Supply Application VDD GND SDA SCL TMP114 0.1 µF 1.08 V to 1.98 V 1.2 kΩ I 2C Controller SDA SCL 1.2 kΩ 1.2 V Temperature source Figure 9-1. Separate I2C Pullup and Supply Voltage Application 9.2.1 Design Requirements For this design example, use the parameters listed below. Table 9-1. Design Parameters Parameter Value Supply (VDD) 1.08 V to 1.98 V SDA, SCL VPULLUP 1.2 V SDA, SCL RPULLUP 1.2 kΩ 9.2.2 Detailed Design Procedure The TMP114 will convert temperature at a default 250 ms interval with an adjustable conversion period between 6.4 ms and 2 s. The SDA and SCL pin voltage of the TMP114 can be at a higher voltage than the VDD pin voltage, removing the need for power sequencing when using the TMP114. The TMP114 comes in an ultra-small body and z-height package the user can place as close to temperature sources as possible for better thermal coupling. www.ti.com TMP114 SNIS214A – JUNE 2021 – REVISED SEPTEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: TMP114 |
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