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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MCIMX503CVM8B датащи(PDF) 116 Page - NXP Semiconductors |
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MCIMX503CVM8B датащи(HTML) 116 Page - NXP Semiconductors |
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116 / 136 page  i.MX50 Applications Processors for Consumer Products, Rev. 7 Package Information and Contact Assignments Freescale Semiconductor 116 5.3 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package Information This section contains the outline drawing, signal assignment map, ground, power, reference ID (by ball grid location) for the 17 x 17 mm, 0.8 mm pitch, 400 pin MAPBGA package. VDD2P5 AD4 — VDD3P0 AD3 — VDDA P17, R17 — VDDAL1 P15, R15 — VDDGP G10, G8, G9, H10, H7, H8, H9, J7, J8, K10, K7, K8, L10, L7, L8 — VDDO25 N23 — VSS A1, A24, AA11, AA18, AA2, AA9, AC18, AC3, AC4, AC6, AC7, AD1, AD18, AD24, E17, E18, E21, E8, E9, F21, G11, G12, G13, G21, G23, H11, H12, H13, K11, K12, K13, L11, L12, L13, L14, L17, M11, M14, M15, M17, N11, N14, N15, N17, P11, P12, P13, P14, R11, R12, R13, R14, T17, U12, U13, U14, U15, U16, U17 — Table 82. 416 PoPBGA 13 x 13 mm Ground, Power, Sense, and Reference Contact Signals (continued) |
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